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Specifications

Technological capabilities
DOWNLOAD DESIGN GUIDELINES (.pdf)

Technological capabilities

  • Board type
    SS – Single-sided printed circuit board
    DS – Double-sided printed circuit board
    ML – Multilayer printed circuit board
  • Basic material
    FR4, CEM1
    IMS (Al), IMS (Cu)
    PTFE, RF
    IZOKART (Pertinaks), VITROPLAST
  • Manufacturers of basic materials
    Kingboard, Nanya, Isola, Rogers, Bergquist, ...
  • Thermal stability
    TG130 - TG210
  • Thermal conductivity of IMS
    0,3 W/m°C
    2,0 W/m°C (standard)
    5 W/m°C
  • Maximal work panel
    500 x 600 mm
  • Thickness of finished PCB
    0,2 mm - 3,2 mm
  • Thickness of inner layers
    0,08 mm - 3,2 mm
  • Minimum line width
    70 µm (70 µm)
  • Thickness of base copper foil
    18 μm, 35 μm, 70 μm, 105 μm
  • Thickness of base copper foil on intermediate layers
    18 μm, 35 μm, 70 μm, 105 μm
  • Diameter of the smallest non-bore hole
    0,15 mm
  • Vrste izvrtin
    Through hole
    Blind vias
    Buried vias
    Half holes
  • Blind vias (depth-to-diameter ratio)
    1 : 1
  • Solder mask
    Green: matt, glossy (standard)
    Black
    White
    Blue
    Red
    Yellow
  • Minimum gap in fine pitch
    70 μm
  • Silk screen color
    White
    Green
    Yellow
    Black
    Red
    Blue
  • Peelable mask
    EM55/4748 R-LF (Electra Polymer)
  • Tented via
    With solder mask
  • Filled via
    With non-conductive past,
    According to IPC-4761 - 6a + 6b + 7
  • Surface treatment
    HAL lead-free (RoHS)
    Immersion Au (ENIG)
    Galvanic Au (Hard gold)
  • Mechanical tolerance
    According to DIN ISO 2768 T1
  • Final product thickness
    +/-10 %
  • Etching tolerance
    +/-20 % (+/-10%)
Documentation Electronic components SMT printing SMT installation Tower storage system 3D AOI inspection THT insertion and wave soldering Functionality test Cleaning and coating of PCBs
DOWNLOAD DESIGN GUIDELINES (.pdf)

Documentation

Well-prepared documentation is essential for a well-made product.

To make the product, we will need the following:

  • GERBER files
  • BILL OF MATERIALS (Excel file)
  • PICK AND PLACE file
  • TESTING PROTOCOL (if you require final testing of PCBs)

Electronic components

We always purchase electronic components according to their exact designations declared by the customer. If a particular component is not in stock or the supply period is extremely long, we recommend an alternative product or ask for a suggested replacement option.

Options:

  • components supplied by customer
  • components partly supplied by the customer and partly by LUZNAR d.o.o.
  • components entirely supplied by LUZNAR d.o.o.

SMT printing

At LUZNAR d.o.o. we no longer use stencils to apply soldering paste on printed circuit boards. This acquisition has greatly improved the SMT component installation and reduced the costs of initial preparations.

We have added an extra printer to our wide array of equipment.

Printing specification:

  • Print precision
    20 µ
  • Minimum point size
    215 µ
  • Minimum point volume
    5 nl
  • Maximum panel size for our machine
    508x508 mm
  • Circuit thickness
    50µ -> 6,0 mm

Printing advantages:

  • Built-in optical paste control
  • Automatic paste touch-up
  • Printing of glue
  • Printing of lead-free paste
  • Printing of leaded paste
  • Optional combined printing of adhesive and paste
  • Replacing the product for assembly 1 min

SMT installation

We use a world renowned brand in the field of electronic component installation. Specifically, SAMSUNG, which is distinguished by accuracy, speed and reliability. We added two new MYCRONIC electronic component installations.

This year we have incorporated two new MYCRONIC laying lines.

Installation specification:

  • Speed of assembly:
    54.000 components per hour
  • Accuracy:
    ±0,01mm
  • Minimum component:
    01005 (0,4 x 0,2 mm)
  • Maximum component:
    75 x 75 mm
  • Thickness of PCBs:
    50µ -> 4,2 mm
  • Maximal panel size for our machine:
    500 x 400 mm

Installation advantages:

  • Trolleys used for material:
    allow a fast replacement of products
  • The product is replaced in 15 minutes
  • Smart feeders:
    for component traceability

 

Advantages:

  • Traceability of components
  • Controlled atmosphere storage
  • Automatic component preparation

3D AOI inspection

With regard to precision, the 3D inspection technology for assembled boards is at the cutting edge. Our machine checks every single PCB passing through our assembly department. We are able to examine the accuracy of component installation by width, length, height and rotation. In addition, we also examine the inscriptions on the components to eliminate any misplaced components. At Tiskana vezja LUZNAR d.o.o., the circuit boards are also marked with serial numbers, which can help us track the errors during the production process.

SMT optical inspection:

  • Camera:
    15 mega Pixel
  • Resolution:
    10µ
  • Minimum component:
    01005 (0,4x0,2mm)
  • Maximum panel size for our machine:
    500 x 400mm

THT insertion and wave soldering

In recent years, the THT component insertion technology has been facing a steady decline. The PCBs are becoming ever more complex and developers are increasingly avoiding the THT components, which are being replaced with SMT components. This technology is still used at LUZNAR.

Capabilities:

  • Robotic cutting of THT capacitors
  • Wave soldering of THT components
  • Production of 3D soldering masks

Functionality test

At Tiskana vezja LUZNAR d.o.o., we develop measurement protocols, testing devices and provide advice in the preparation of test protocols. We pay close attention to the inspection and calibration of PCBs, as we are well aware that our customers want circuit boards that work 100%.

Cleaning and coating of PCBs

Electronic devices are becoming more and more visible. This has led us to conclude that PCBs should have a visually appealing design. The demand for PCB cleaning grows every day and Tiskana vezja LUZNAR d.o.o. certainly follows the preferences of its customers.

The PCBs which are exposed to extreme temperatures, humidity, dust and vibrations require additional protection. We can ensure this by providing coating services, applying encapsulation materials and making sure that large components are securely attached.

Highest quality certificates

TUV SUD
CULUS
AAA BISNODE
IPC

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Contact us

  • Company name
    Tiskana vezja LUZNAR d.o.o.
  • Short company name
    LUZNAR d.o.o.
  • Address
    Hrastje 52G, 4000 KRANJ, Slovenija
  • Phone
    +386 4 281 88 00
  • Fax
    +386 4 281 88 08
  • E-mail
    info@luznar.com