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Technological capabilities
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Board typeSS – Single-sided printed circuit board
DS – Double-sided printed circuit board
ML – Multilayer printed circuit board -
Basic materialFR4, CEM1
IMS (Al), IMS (Cu)
PTFE, RF
IZOKART (Pertinaks), VITROPLAST -
Manufacturers of basic materialsKingboard, Nanya, Isola, Rogers, Bergquist, ...
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Thermal stabilityTG130 - TG210
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Thermal conductivity of IMS0,3 W/m°C
2,0 W/m°C (standard)
5 W/m°C -
Maximal work panel500 x 600 mm
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Thickness of finished PCB0,2 mm - 3,2 mm
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Thickness of inner layers0,08 mm - 3,2 mm
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Minimum line width70 µm (70 µm)
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Thickness of base copper foil18 μm, 35 μm, 70 μm, 105 μm
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Thickness of base copper foil on intermediate layers18 μm, 35 μm, 70 μm, 105 μm
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Diameter of the smallest non-bore hole0,15 mm
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Vrste izvrtinThrough hole
Blind vias
Buried vias
Half holes -
Blind vias (depth-to-diameter ratio)1 : 1
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Solder maskGreen: matt, glossy (standard)
Black
White
Blue
Red
Yellow -
Minimum gap in fine pitch70 μm
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Silk screen colorWhite
Green
Yellow
Black
Red
Blue -
Peelable maskEM55/4748 R-LF (Electra Polymer)
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Tented viaWith solder mask
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Filled viaWith non-conductive past,
According to IPC-4761 - 6a + 6b + 7 -
Surface treatmentHAL lead-free (RoHS)
Immersion Au (ENIG)
Galvanic Au (Hard gold) -
Mechanical toleranceAccording to DIN ISO 2768 T1
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Final product thickness+/-10 %
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Etching tolerance+/-20 % (+/-10%)
Documentation
Well-prepared documentation is essential for a well-made product.
To make the product, we will need the following:
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GERBER files
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BILL OF MATERIALS (Excel file)
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PICK AND PLACE file
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TESTING PROTOCOL (if you require final testing of PCBs)
Electronic components
We always purchase electronic components according to their exact designations declared by the customer. If a particular component is not in stock or the supply period is extremely long, we recommend an alternative product or ask for a suggested replacement option.
Options:
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components supplied by customer
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components partly supplied by the customer and partly by LUZNAR d.o.o.
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components entirely supplied by LUZNAR d.o.o.
SMT printing
At LUZNAR d.o.o. we no longer use stencils to apply soldering paste on printed circuit boards. This acquisition has greatly improved the SMT component installation and reduced the costs of initial preparations.
We have added an extra printer to our wide array of equipment.

Printing specification:
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Print precision20 µ
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Minimum point size215 µ
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Minimum point volume5 nl
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Maximum panel size for our machine508x508 mm
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Circuit thickness50µ -> 6,0 mm
Printing advantages:
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Built-in optical paste control
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Automatic paste touch-up
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Printing of glue
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Printing of lead-free paste
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Printing of leaded paste
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Optional combined printing of adhesive and paste
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Replacing the product for assembly 1 min
SMT installation
We use a world renowned brand in the field of electronic component installation. Specifically, SAMSUNG, which is distinguished by accuracy, speed and reliability. We added two new MYCRONIC electronic component installations.
This year we have incorporated two new MYCRONIC laying lines.
Installation specification:
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Speed of assembly:54.000 components per hour
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Accuracy:±0,01mm
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Minimum component:01005 (0,4 x 0,2 mm)
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Maximum component:75 x 75 mm
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Thickness of PCBs:50µ -> 4,2 mm
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Maximal panel size for our machine:500 x 400 mm
Installation advantages:
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Trolleys used for material:allow a fast replacement of products
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The product is replaced in 15 minutes
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Smart feeders:for component traceability

Advantages:
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Traceability of components
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Controlled atmosphere storage
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Automatic component preparation
3D AOI inspection
With regard to precision, the 3D inspection technology for assembled boards is at the cutting edge. Our machine checks every single PCB passing through our assembly department. We are able to examine the accuracy of component installation by width, length, height and rotation. In addition, we also examine the inscriptions on the components to eliminate any misplaced components. At Tiskana vezja LUZNAR d.o.o., the circuit boards are also marked with serial numbers, which can help us track the errors during the production process.

SMT optical inspection:
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Camera:15 mega Pixel
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Resolution:10µ
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Minimum component:01005 (0,4x0,2mm)
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Maximum panel size for our machine:500 x 400mm
THT insertion and wave soldering
In recent years, the THT component insertion technology has been facing a steady decline. The PCBs are becoming ever more complex and developers are increasingly avoiding the THT components, which are being replaced with SMT components. This technology is still used at LUZNAR.
Capabilities:
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Robotic cutting of THT capacitors
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Wave soldering of THT components
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Production of 3D soldering masks
Functionality test
At Tiskana vezja LUZNAR d.o.o., we develop measurement protocols, testing devices and provide advice in the preparation of test protocols. We pay close attention to the inspection and calibration of PCBs, as we are well aware that our customers want circuit boards that work 100%.
Cleaning and coating of PCBs
Electronic devices are becoming more and more visible. This has led us to conclude that PCBs should have a visually appealing design. The demand for PCB cleaning grows every day and Tiskana vezja LUZNAR d.o.o. certainly follows the preferences of its customers.
The PCBs which are exposed to extreme temperatures, humidity, dust and vibrations require additional protection. We can ensure this by providing coating services, applying encapsulation materials and making sure that large components are securely attached.
Submit an inquiry
Our team will provide the best solution for your company.
Contact us
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Company nameTiskana vezja LUZNAR d.o.o.
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Short company nameLUZNAR d.o.o.
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AddressHrastje 52G, 4000 KRANJ, Slovenija
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Phone+386 4 281 88 00
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Fax+386 4 281 88 08
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E-mail